PCB Assembly

PCB Assembly Services

The assembly of printed circuit boards(PCB) is a multiple step process that includes surface mount technology (SMT) and through hole technology. In through hole assembly processes, the component leads are placed onto the board and the leads are soldered via Dip soldering process. Some SMT components can be placed on the bottom side of the board and soldered by the wave soldering process. In the SMT process, solder paste is deposited onto the connection pads of the printed circuit board, components are placed onto theses pads, reflowed in a reflow furnace to melt the solder paste to form the electrical and mechanical connection of the component leads to the printed circuit board(PCB).

Surface Mount Assembly – SMT

  • Tin Lead or RoHS Compliant
  • High Speed Pick and Place
  • High Volume Production
  • Single and Double Sided SMT assembly
  • Min. pitch 0.25mm placement
  • SMD packages down to 0402
  • Largest component: QFP & BGA’s to 55 x 55mm
  • Multi-Zone Convection Reflow Ovens
  • Semi-Automatic Screen Printing
  • Max PCB panel size: 1500mm L x 400mm W
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Through Hole Assembly

Jayshree Instruments is able to handle a wide range of capabilities that add value to your product. Jayshree Instruments through hole operations also utilize state-of-the-art component prep equipment. Complements our through hole assembly processes enabling Jayshree Instruments to be completely lead-free RoHS compliant.

  • Our PCB through-hole technology capabilities include insertion.
  • This results in a high level of product quality and feels like one of your own trusted employees is handling the project.
  • As the first step in the production process, product quality begins here. We use a rigorous first piece process and our highly skilled operators and engineering support team closely monitor each project to ensure the best results for our customers.

Conformal Coating

Jayshree Instruments provides selective and bulk conformal coating services for printed circuit boards (PCBs) and other electronic devices.

  • Spraying
  • Spray coating with component masking
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